Intersystem bonding bridges are installed for compliance with the 2008 NEC Article 250.49 which requires all utility (telephone, cable, satellite, etc.) grounding conductors to be bonded to ground in a single location in small, commercial and residential applications. Intersystem bonding bridges are connected directly to the grounding electrodes with lay-in style lugs. Their Integrated mounting holes provide for a quick, compact installation. They have a corrosion resistant aluminum construction with tin plating for maximum conductivity. Additionally a paintable polycarbonate cover is included for additional protection and aesthetically-pleasing installation.